Display device

ABSTRACT

The display device includes a substrate, a display region arranged on the substrate and including a plurality of pixels, a first wiring provided on the substrate, an insulating layer overlapping a portion of the first wiring, an oxide conductive layer provided on the first wiring and electrically connected to the first wiring, a sealing layer overlapping the display region and at least an end of the oxide conductive layer and sealing the plurality of pixels, a sensor electrode provided on the sealing layer and overlapping the display region, and a second wiring passing over the at least end of the oxide conductive layer provided with the sealing layer and electrically connecting the sensor electrode and the oxide conductive layer.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.17/545,002, filed on Dec. 8, 2021, which, in turn, is a continuation ofU.S. patent application Ser. No. 16/841,746 (now U.S. Pat. No.11,227,901), filed on Apr. 7, 2020. Further, this application is basedupon and claims the benefit of priority from the prior Japanese PatentApplication No. 2017-202379 filed on Oct. 19, 2017, and PCT ApplicationNo. PCT/JP2018/032548 filed on Sep. 3, 2018, the entire contents ofwhich are incorporated herein by reference.

FIELD

One embodiment of the present invention relates to a display device andmethods for manufacturing the display device.

BACKGROUND

In a display device to which a flexible printed board is attached, aconnection electrode on a substrate side may be formed by an ITO (IndiumTin Oxide) (for example, Japanese Laid-Open Patent Publication No.2013-214085). The flexible printed board is formed with wirings fortransmitting signals.

SUMMARY

A display device according to an embodiment of the present inventionincludes a substrate, a display region arranged on the substrate andincluding a plurality of pixels, a first wiring provided on thesubstrate, an insulating layer overlapping a portion of the firstwiring, an oxide conductive layer provided on the first wiring andelectrically connected to the first wiring, a sealing layer overlappingthe display region and at least an end of the oxide conductive layer andsealing the plurality of pixels, a sensor electrode provided on thesealing layer and overlapping the display region, and a second wiringpassing over the at least end of the oxide conductive layer providedwith the sealing layer and electrically connecting the sensor electrodeand the oxide conductive layer.

A methods for manufacturing display device according to an embodiment ofthe present invention includes a forming a first wiring on thesubstrate, forming an insulating layer overlapping a portion of thefirst wiring, forming an oxide conductive layer electrically connectedto the first wiring on the first wiring, forming a sealing layer forsealing a pixels so as to overlap the display region and at least an endof the oxide conductive layer, forming a sensor electrode overlappingthe display region including the plurality of pixels on the sealinglayer, and forming a second wiring that passes over the at least end ofthe oxide conductive layer provided with sealing layer and electricallyconnects the sensor electrode and the oxide conductive layer.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a top view showing a configuration of a display deviceaccording to the first embodiment of the present invention;

FIG. 2 is a top view showing a touch sensor according to the firstembodiment the first embodiment of the present invention;

FIG. 3 is a top view showing a portion of a touch sensor according tothe first embodiment of the present invention;

FIG. 4 is a cross-sectional view of the display device according to thefirst embodiment of the present invention;

FIG. 5 is a cross-sectional view of the periphery of a region providedwith a terminal wiring of the display device according to the firstembodiment of the present invention;

FIG. 6 is a cross-sectional view showing comparative examples accordingto the first embodiment of the present invention;

FIG. 7 is a top view showing the configuration of the display deviceaccording to the second embodiment of the present invention;

FIG. 8 is a cross-sectional view of the display device according to thesecond embodiment of the present invention;

FIG. 9 is a cross-sectional view of the periphery of a region providedwith the terminal wiring of the display device according to the secondembodiment of the present invention;

FIG. 10 is a cross-sectional view of the periphery of a region providedwith the terminal wiring of the display device according to the thirdembodiment of the present invention;

FIG. 11 is a cross-sectional view of the periphery of a region providedwith the terminal wiring of the display device according to the fourthembodiment of the present invention;

FIG. 12 is a cross-sectional view showing the first step of a processfor manufacturing the display device according to an embodiment of thepresent invention;

FIG. 13 is a cross-sectional view showing the second step of a processfor manufacturing the display device according to an embodiment of thepresent invention;

FIG. 14 is a cross-sectional view showing the third step of a processfor manufacturing the display device according to an embodiment of thepresent invention;

FIG. 15 is a cross-sectional view showing the fourth step of a processfor manufacturing the display device according to an embodiment of thepresent invention;

FIG. 16 is a cross-sectional view showing the fifth step of a processfor manufacturing the display device according to an embodiment of thepresent invention;

FIG. 17 is a cross-sectional view showing the sixth step of a processfor manufacturing the display device according to an embodiment of thepresent invention;

FIG. 18 is a cross-sectional view showing the seventh step of a processfor manufacturing the display device according to an embodiment of thepresent invention;

FIG. 19 is a top view showing a portion of a touch sensor according to amodification of the present embodiment of the present invention.

DESCRIPTION OF EMBODIMENTS

A display device provided with the on-cell type touch sensor for forminga sensor electrode on the sealing layer can be expected to contribute tothinning and low costs of the display device. In such a display device,a wiring extending from the electrodes used for a touch sensor(hereinafter, referred to as “sensor electrode”) may be arranged on thesubstrate and electrically connected to a predetermined terminal. Thewiring may be susceptible to fracture due to the topography of thesubstrate.

In view of the above problems, it is one object of the present inventionto provide a technique for electrically connecting the sensor electrodeand the terminal while suppressing the terminal on the substrate frombeing damaged.

Each embodiment of the present invention is explained below whilereferring to the drawings. It is noted that the disclosure is merely anexample, and those skilled in the art can easily conceive of appropriatemodifications while maintaining the gist of the invention are naturallyincluded in the scope of the invention. In addition, although thedrawings may schematically represent the width, thickness, shape, andthe like of each portion as compared with actual embodiments for thesake of clarity of description, the drawings are merely an example anddo not limit the interpretation of the present invention.

In this specification and each drawing, the same reference numerals areassigned to the same elements as those described above with reference tothe preceding drawings, and detailed description thereof may be omittedas appropriate. In addition, the letters “first” and “second” to eachelement are convenient labels used to distinguish each element and haveno further meaning unless otherwise stated.

Also, in this specification, when one member or region is “above (orbelow)” another member or region, this includes not only being directlyabove (or below) the other member or region, but also being above (orbelow) the other member or region, i.e., including other components inbetween above (or below) the other member or region. In the followingexplanation, unless otherwise specified, in the cross-sectional view,the side on which display element is arranged with respect to thesubstrate is referred to as “upper” or “upper surface”, and the oppositeside is referred to as “lower” or “lower surface”.

Also, the phrases “α includes A, B, or C”, “α includes any of A, B, andC”, and “α includes one selected from the group consisting of A, B, andC” in this specification do not exclude the case where α includes aplurality of combinations of A to C, unless otherwise specified.Furthermore, these expressions do not exclude the case where α includesother elements.

First Embodiment <1. Configuration of the Display Device>

FIG. 1 shows a top view of a display device 10 according to anembodiment of the present disclosure.

The display device 10 is an organic EL display device. The displaydevice 10 includes a substrate 100, a flexible printed board 106, aplurality of terminals 107, a driving circuit 108, a plurality ofterminals 109, and a touch sensor 20.

A top surface of the substrate 100 includes a display region 102 and aperipheral region 104. The display region 102 is a region for displayingan image (static image or moving image). The display region 102 includesa plurality of pixels 130. The plurality of pixels 130 is arranged in amatrix, for example. The peripheral region 104 is a region the perimeterof the display region 102 and is a non-display region, displaying noimages.

The plurality of terminals 107 is provided on the peripheral region 104above the substrate 100. The flexible printed board 106 is affixed tothe substrate 100 at the peripheral region 104 and is electricallyconnected to each of the plurality of terminals 107. The driving circuit108 is provided on the flexible printed board 106. The flexible printedboard 106 drives the plurality of pixels 130 and the touch sensor 20.Specifically, the driving circuit 108 supplies signals for driving theplurality of pixels 130 (e.g., various video signals and controlsignals) and signals for driving the touch sensor 20 (e.g., signals forinstructing the sensor electrode to supply voltages for detecting).Although not shown in FIG. 1 , a gate driver and a source driver may beprovided on the substrate 100. The gate driver and the source driverdrive the plurality of pixels 130 in response to signals from thedriving circuit 108.

The touch sensor 20 is superimposed on the display region 102. The touchsensor 20 is here an on-cell touch sensor. The on-cell method is amethod of incorporating the touch sensor inside the display device. Theplurality of terminals 109 is provided on the peripheral region 104 onthe substrate 100. Each of the plurality of terminals 109 iselectrically connected to the flexible printed board 106 via any one ofthe terminals 107.

<2. Configuration of the Touch Sensor 20>

FIG. 2 is a top view showing the touch sensor 20. Here, the touch sensor20 is a mutual-capacitive touch sensor. The touch sensor 20 includes aplurality of first sensor electrodes 210A and a plurality of secondsensor electrodes 210B. Each of the plurality of first sensor electrodes210A and the plurality of second sensor electrodes 2106 overlaps withthe display region 102. The plurality of first sensor electrodes 210Aand the plurality of second sensor electrodes 210B are insulated fromeach other.

Here, the first sensor electrode 210A and the second sensor electrode210B are diamond-shaped electrodes having diagonals in the D1 and D2directions. Although, the first sensor electrode 210A and the secondsensor electrode 210B are, for example, transparent conductive filmusing indium zinc oxide (IZO), using as the first sensor electrode 210Aand the second sensor electrode 210B may be indium tin oxide (ITO), zincoxide (ZnO), indium tin oxide zinc (ITZO), or the like.

The plurality of first sensor electrodes 210A and the plurality ofsecond sensor electrodes 210B are arranged, respectively. The two firstsensor electrodes 210A adjacent to each other in the short sidedirection (hereinafter referred to as “D1 direction”) of the displayregion 102 are connected to each other. The two first sensor electrodes210A adjacent to each other in the long side direction of the displayregion 102 (hereinafter referred to as “D2 direction”) are separatedfrom each other. The wiring including the plurality of first sensorelectrodes 210A extending in the D1 direction is hereinafter referred toas “a first touch sensor wiring 212A”. The two second sensor electrodes210B adjacent to each other in the D2 direction are connected to eachother. The two second sensor electrodes 210B adjacent to each other inthe D1 direction are separated from each other. The wiring including theplurality of second sensor electrodes 210B extending in the D2 directionis hereinafter referred to as “a second touch sensor wiring 212B”. TheD1 and the D2 directions intersect each other. The first sensorelectrode 210A is the transmit electrode in the touch sensor 20. Thesecond sensor electrode 210B is a receiving electrode in the touchsensor 20. Alternatively, the second sensor electrode 210B may be thetransmitting electrode in the touch sensor 20, and the first sensorelectrode 210A may be the receiving electrode in the touch sensor 20.

FIG. 3 is an enlarged top view of a region 20R which is a portion of thetouch sensor 20. The two first sensor electrodes 210A adjacent to eachother in the D1 direction are electrically connected to each otherthrough a bridge member 214A. The bridge member 214A may be formed ofthe same material as the first sensor electrode 210A or may be formed ofa different material. The first touch sensor wiring 212A shown in FIG. 2includes the plurality of first sensor electrodes 210A, a plurality ofbridge members 214A, and a lead wiring 216. The two second sensorelectrodes 210B adjacent to each other in the D2 direction areelectrically connected to each other through a bridge member 214B. Thebridge member 214A is provided on the bridge member 214B. Theintersection of the bridge member 214A and the bridge member 214B isinsulated vertically through the insulating layer. The second touchsensor wiring 212B shown in FIG. 2 includes the plurality of secondsensor electrodes 210B, the plurality of bridge members 214B, and thelead wiring 216.

Hereinafter, when the first sensor electrode 210A and the second sensorelectrode 210B are not distinguished from each other, they arecollectively referred to as “sensor electrode 210”. Of the plurality ofsensor electrodes 210, the sensor electrode 210 adjoining the respectivesides of the display region 102 is electrically connected to any one ofthe terminal members 109 via the lead wiring 216. The lead wiring 216 isprovided on a moisture shut-off region T and a sealing layer 180.

<3. Driving the Touch Sensor 20>

The driving circuit 108 supplies voltages to the first sensor electrode210A via the plurality of first touch sensor wirings 212A. An electricfield corresponding to the supplied voltages is generated between thefirst sensor electrode 210A and the second sensor electrode 210B. Forexample, when a human finger touches the display device 10, the electricfield between the first sensor electrode 210A and the second sensorelectrode 210B changes. As a result, the capacitance between the firsttouch sensor wiring 212A and the second touch sensor wiring 212B. Thedriving circuit 108 receives signals from the second sensor electrode210B via the plurality of second touch sensor wirings 212B. Based onthese signals, the display device 10 detects a position touched by ahuman finger. In this instance, the driving circuit 108 drives the firstsensor electrode 210A to read the change in the capacitance via thesecond sensor electrode 210B. The driving circuit 108 may, conversely,drive the second sensor electrode 210B to read changes in capacitancevalues via the first sensor electrode 210A.

<4. Cross-Sectional Structure>

FIG. 4 shows a cross-sectional view of the display device 10. FIG. 4 isa cross-sectional view along the cutting line X1-X2 in FIG. 3 . Thecutting line X1-X2 shows the cutting line passing through the sensorelectrode 210, the bridge member 214A, the lead wiring 216, and theterminals 107 and 109.

The substrate 100 is, for example, a substrate having flexibility. Thesubstrate 100 may be referred to as a substrate, a base film, or asheet-substrate. The substrate 100 is, for example, an organic resinsubstrate. The organic resinous materials constituting substrate 100 is,for example, polyimides, acrylics, epoxies, and polyethyleneterephthalates. The thickness of the substrate 100 is, for example,between 10 μm and several hundred micrometers.

A transistor 140 is provided on the substrate 100 via an under film 101.The transistor 140 includes a semiconductor film 142, a gate insulatingfilm 144, a gate electrode 146, and a source/drain electrode 148. Thegate electrode 146 overlaps the semiconductor film 142 via the gateinsulating film 144. A channel region 142 a of the semiconductor film142 is a region that overlaps with the gate electrode 146. Thesemiconductor film 142 has a source/drain region 142 b sandwiching thechannel region 142 a.

An interlayer film 103 is provided on the gate electrode 146. Theinterlayer film 103 includes, for example, an inorganic insulating filmsuch as a silicon oxide film, a silicon nitride film, or a siliconoxynitride film. The source/drain electrode 148 is connected to thesource/drain region 142 b at an opening provided in the interlayer film103 and the gate insulating film 144.

The transistor 140 is here a top-gate type transistor but may be anyother transistors. The transistor 140 may be, for example, a bottom gatetype transistor, a multi-gate type transistor having a plurality of gateelectrodes 146, or a dual-gate type transistor having a configuration inwhich the upper and lower sides of the semiconductor film 142 aresandwiched by two gate electrodes 146.

A terminal wiring 220 is a first wiring provided on the substrate 100.The terminal wiring 220 is provided on the peripheral region 104. Theterminal wiring 220 is in contact with the substrate 100 at a region 158where the interlayer film 103, the gate insulating film 144, and theunder film 101 have been removed. In this section, the display device 10is foldable. The inorganic insulating film has low toughness and issusceptible to cracking when bending forces are applied. Therefore, itis preferable to remove the portion around the bent portion as shown inFIG. 4 . The terminal wiring 220 is formed of, for example, a materialcontaining aluminum, copper, molybdenum, or tungsten as a maincomponent, but may be formed of a material other than aluminum, copper,molybdenum, or tungsten.

A planarization film 114 is provided overlapping a portion of theterminal wiring 220. Specifically, the planarization film 114 overlapsthe interlayer film 103 and the transistor 140 in addition to a portionof the terminal wiring 220. The upper surface of the planarization film114 is flat. The planarization film 114 includes, for example, anacrylic resin, an organic resin including polysiloxane, polyimides,polyesters, and the like. The planarization film 114 is an insulatinglayer (the first insulating layer) containing an organic substance. Aninorganic insulating film 150 is provided on the planarization film 114.The inorganic insulating film 150 protects a semiconductor device suchas the transistor 140. The planarization film 114 and the inorganicinsulating film 150 are provided with a contact hole 152. The contacthole 152 is an opening for electrically connecting a first electrode 162and the source/drain electrode 148 of a light-emitting element 160,which will be described later.

The light-emitting element 160 is provided on the inorganic insulatingfilm 150. The light-emitting element 160 includes the first electrode(the pixel electrode) 162, an emitting layer 164, and a second electrode(the counter electrode) 166. The first electrode 162 covers the contacthole 152. The first electrode 162 is electrically connected to thesource/drain electrode 148. A bank 168 covers the end of the firstelectrode 162. The bank 168 covers the end of the first electrode 162.This prevents disconnection of the emitting layer 164 and the secondelectrode 166 provided thereon. The pixel 130 includes thelight-emitting element 160 and the transistor 140.

The emitting layer 164 covers the first electrode 162 exposed from thebank 168. Although, in FIG. 4 , the emitting layer 164 is formed only onan opening of the bank 168, a portion of the emitting layer 164 may beformed to extend over the bank 168 or may be uniformly formed as aplurality of pixel layers. The second electrode 166 is provided on theemitting layer 164. Here, the emitting layer 164 is formed of using lowmolecular weight or high molecular weight organic EL materials. Theemitting layer 164 emits light in response to voltages supplied to thefirst electrode 162 and the second electrode 166. Specifically, carriersare injected from the first electrode 162 and the second electrode 166into the emitting layer 164. Within the emitting layer 164, the carriersrecombine. The emitting layer 164 emits light when the luminescentmolecules go into an excited state and the excited state relaxes to aground state. A region in contact with the first electrode 162 and theemitting layer 164 is the light emission region of the pixel 130. Theemitting layer 164 includes, for example, a carrier injection layer, acarrier transport layer, an emitting layer, a carrier blocking layer,and an exciton blocking layer. The light-emitting element 160 is anorganic EL element.

An oxide conductive layer 230 is provided on the terminal wiring 220.Specifically, the oxide conductive layer 230 is provided directly abovethe terminal wiring 220 in a contact hole provided in the planarizationfilm 114 and the inorganic insulating film 150. The terminal 109 is anelectrode in which the terminal wiring 220 is brought into stacked layerwith the oxide conductive layer 230 in the contact hole. The oxideconductive layer 230 is formed of, for example, indium tin oxide (ITO),but may also be formed of a conductive oxide such as indium zinc oxide(IZO), zinc oxide (ZnO), or indium tin oxide zinc (ITZO).

The sealing layer 180 is provided on the display region 102 and aportion of the peripheral region 104 to seal the plurality of pixels130. The sealing layer 180 is provided at least at the end of a portionof the oxide conductive layer 230 in the terminal member 109 of theperipheral region 104. The sealing layer 180 prevents impurities(moisture, and oxygen, etc.) from entering the light-emitting element160 and the transistor 140 from the outside. The sealing layer 180specifically includes a first inorganic film 182, an organic film 184,and a second inorganic film 186. The first inorganic film 182 and thesecond inorganic film 186 are, for example, films containing inorganiccompound. The first inorganic film 182 and the second inorganic film 186include, for example, an inorganic insulating material such as a siliconnitride film or an aluminum oxide film. The organic film 184 is providedbetween the first inorganic film 182 and the second inorganic film 186,and is a film containing organic compound, for example. The organic film184 includes, for example, organic resins including acrylics,polysiloxane, polyimides, polyesters, and the like.

The sensor electrode 210 (the first sensor electrode 210A and the secondsensor electrode 210B) is provided on the sealing layer 180 (morespecifically, on the second inorganic film 186) in the display region102.

An interlayer insulating film 190 is a second insulating layer providedon the sensor electrode 210 and the sealing layer 180. The interlayerinsulating film 190 includes, for example, organic resins includingacrylics, polysiloxane, polyimides, polyesters, and the like.

The bridge member 214A and the lead wiring 216 are provided on theinterlayer insulating film 190. The bridge member 214A is provided at aposition that does not overlap the light-emitting element 160, morespecifically, at a position that overlaps the bank 168. The interlayerinsulating film 190 is provided with a contact hole 192. The contacthole 192 is an opening for electrically connecting the sensor electrode210 and the lead wiring 216.

Below the lead wiring 216, the planarization film 114 is provided with acontact hole. As a result, the inorganic insulating film 150, the firstinorganic film 182, and the organic film 184 are turned stacked layer.This stacked structure configures the moisture shut-off region T, sinceit prevents the penetration of moisture into the emitting layer 164.

The lead wiring 216 is provided on the interlayer insulating film 190and extends from the display region 102 towards the terminal 109.Specifically, the lead wiring 216 is a second wiring that passes overthe end of the oxide conductive layer 230 provided with the sealinglayer 180 to electrically connect the sensor electrode 210 and the oxideconductive layer 230. The lead wiring 216 is electrically connected tothe terminal wiring 220 via the oxide conductive layer 230 withoutcontacting the terminal wiring 220. The lead wiring 216 may be formed ofthe same material as the terminal wiring 220 or may be formed of adifferent material.

The terminal 107 is provided on a region of the region on theplanarization film 114 closer to the flexible printed board 106 than theregion 158. The terminal 107 is an electrode in which an oxideconductive layer 250 (second oxide conductive layer) is stacked layer tothe terminal wiring 220 in a contact hole provided in the planarizationfilm 114 and the inorganic insulating film 150. The flexible printedboard 106 is not in direct contact with the terminal wiring 220. Theoxide conductive layer 250 is electrically connected to the flexibleprinted board 106 by, for example, an anisotropic conductivity member252. The signals from the flexible printed board 106 are provided to thelead wiring 216 via the oxide conductive layer 250, the terminal wiring220, and the oxide conductive layer 230.

FIG. 5 is an enlarged cross-sectional view of the vicinity of theterminal 109. As shown in FIG. 5 , the first inorganic film 182 of thesealing layer 180 is provided on a portion of an end portion P1 of theoxide conductive layer 230 facing the display region 102. On the otherhand, the sealing layer 180 is not provided on an end portion P2 of theoxide conductive layer 230, which is opposed to the end portion P1. Whenthe display device 10 is cut by other cutting lines passing through thesensor electrode 210, the bridge member 214A, the lead wiring 216, andthe terminal 107 and 109, the cross-sectional structure is substantiallythe same as the structure described with reference to FIGS. 4 and 5 .

In the display device 10, the sealing layer 180 is formed to have athickness of several micrometers to several tens of micrometers in orderto protect the light-emitting element 160 from moisture and the like.Therefore, when the terminal wiring 220 is exposed by etching (e.g., dryetching), the etching needs to be performed sufficiently to avoid theopening shortage due to etching shortage. Therefore, some regions may beover-etched. The over-etching can damage the exposed terminal wiring220, resulting in yield and reliability degradation problems. Therefore,by providing the terminal wiring 220 with the oxide conductive layer230, 250 having high etching resistance, the surface of the terminalwiring 220 is less likely to be damaged when over-etching is performed.The oxide conductive layer is generally suitable for reducing damages tothe terminal wiring 220 because of its low selectivity to organic layerand wiring etches. In the present embodiment, the terminal 107 includesthe oxide conductive layer 250 but may not include the oxide conductivelayer 250.

As shown in FIG. 5 , the end portion P1 is covered with the firstinorganic film 182 of the sealing layer 180. On the other hand, the endportion P2 of the oxide conductive layer 230, which is opposed to theend portion P1, is not covered by the sealing layer 180. At the endportion P2, a part of the planarization film 114 is removed by theabove-described over etching, and a step K1 exists on the upper surfaceof the planarization film 114. On the other hand, in the end portion P1,since the planarization film 114 is not removed due to the presence ofthe sealing layer 180, such a step does not occur.

As shown in FIG. 6 , if the end portion P1 is not covered by the sealinglayer 180, a part of the planarization film 114 is removed by theabove-described over etching, and a step K2 exists on the upper surfaceof the planarization film 114. As a result, the lead wiring 216 is aconvex downward in the step K2. As a result, the lead wiring 216 maybreak, as indicated by a break position B. On the other hand, in thedisplay device 10 of the present embodiment, since the step K2 does notexist, the possibility that the lead wiring 216 is broken is reduced.

In the present embodiment, the first sensor electrode 210A and thesecond sensor electrode 210B are provided on the upper surface of theinterlayer insulating film 190 which is the same insulating surface.Therefore, the reflectance differences between the first sensorelectrode 210A and the second sensor electrode 210B are hard to bevisually recognized.

Second Embodiment

FIG. 7 is an enlarged top view of the region 20R which is a part of thetouch sensor 20 of the display device 10 according to the secondembodiment. FIG. 8 is a cross-sectional view along the cutting lineX3-X4 in FIG. 7 . The cutting line X3-X4 shows a cutting line passingthrough the sensor electrode 210, the bridge member 214A, the leadwiring 216, and the terminal 107, 109. FIG. 9 is an enlargedcross-sectional view of the vicinity of the terminal 109. In thisembodiment, the sealing layer 180 has an opening 300 corresponding toeach of the plurality of terminals 109. The opening 300 is formed suchthat a sealing layer 180 is provided on all ends of the terminal 109. Asshown in FIG. 8 , the sealing layer 180 is provided on at least a partof an end portion of the oxide conductive layer 250. The flexibleprinted board 106 is provided on an end portion of the oxide conductivelayer 250 provided with the sealing layer 180 and is electricallyconnected to the oxide conductive layer 250. As a result, the terminal107 can be expected to suppress damages to the terminal wiring 220.

Third Embodiment

FIG. 10 is an enlarged cross-sectional view of the vicinity of theterminal 109 according to the third embodiment. In the third embodiment,the interlayer insulating film 190 is provided in region P3, P4 thatoverlaps the oxide conductive layer 230. The lead wiring 216 is providedon the interlayer insulating film 190 so that the interlayer insulatingfilm 190 is present directly below it. Therefore, the base film of thepart where the lead wiring 216 is formed is made uniform, and theadhesion between the lead wiring 216 and the base film is easily madeuniform. As a result, the variation of the CD (Critical Dimension) inthe wiring forming is reduced. An opening 400 of the interlayerinsulating film 190 exposing the oxide conductive layer 230 is smallerthan an opening 500 of the sealing layer 180. This allows the peripheralregion 104 to be reduced in size.

Forth Embodiment

FIG. 11 is an enlarged cross-sectional view of the vicinity of theterminal 109 according to the fourth embodiment. In this embodiment, awiring layer 260 (third wiring) is provided between the oxide conductivelayer 230 and the lead wiring 216. The wiring layer 260 is provided onthe terminal wiring 220, the first inorganic film 182, and the secondinorganic film 186. The wiring layer 260 may be formed of the samematerial as the sensor electrode 210 or may be formed of anothermaterial. The lead wiring 216 is electrically connected to the terminalwiring 220 via the wiring layer 260 and the oxide conductive layer 230.The presence of the wiring layer 260 makes the terminal wiring 220 lesslikely to be damaged.

<5. Manufacturing Method of the Display Device 10>

Examples of methods for manufacturing the display device 10 will bedescribed. FIGS. 12 to 18 are diagrams for explaining the manufacturingprocess of the display device 10 according to the first embodiment.

FIG. 12 is a diagram for explaining the first step of the manufacturingprocess of the display device 10. The first step is to form the terminalwiring 220 on the substrate 100. In the present embodiment, the firststep is to form the substrate 100 with the under film 101, asemiconductor film 132, the gate insulating film 144, the gate electrode146, and the interlayer film 103 formed on the substrate 100, andfurther form the region 158 on the interlayer film 103, and then form asubstrate 220 so as to be positioned on the region 158. Various wiringsand electrodes are formed by, for example, a sputtering method, anevaporation method, a printing method, an ink-jet method, or the like.

FIG. 13 is a diagram for explaining the second step of the manufacturingprocess of the display device 10. The second step is to form theplanarization film 114 on the substrate 100, overlaying a portion of theterminal wiring 220. In this embodiment, the second step is to form theplanarization film 114 after the source/drain electrode 148 is formed.The planarization film 114 is provided with a contact hole for formingthe contact hole 152 and the oxide conductive layer 230, 250. In thesecond step, for example, a wet film forming method such as solutioncoating including a resin material, or formation by photosensitizationis used.

FIG. 14 is a diagram for explaining the third step of the manufacturingprocess of the display device 10. The third step is to form the oxideconductive layer 230, 250 on the planarization film 114 and the terminalwiring 220, which is electrically connected to the terminal wiring 220.In this embodiment, the third step is to form the oxide conductive layer230, 250 in a predetermined contact hole after the inorganic insulatingfilm 150 is formed on the planarization film 114. The inorganicinsulating film 150 is open with a contact hole for forming the contacthole 152, the moisture shut-off region T, and the oxide conductive layer230, 250.

FIG. 15 is a diagram for explaining the fourth step of the manufacturingprocess of the display device 10. The fourth step is to form the sealinglayer 180 that overlaps the ends of the display region 102 at least aportion of the oxide conductive layer 230, 250, and seals the pluralityof pixels 130. In this embodiment, the third step is to form the sealinglayer 180 after the plurality of pixels 130, each including thelight-emitting element 160, is formed on the inorganic insulating film150. In the fifth step, for example, a sputtering method, a CVD method,or the like is used.

FIG. 16 is a diagram for explaining the fifth step of the manufacturingprocess of the display device 10. The fifth step is to form, in thedisplay region 102, the sensor electrode 210 overlying the displayregion 102 on the sealing layer 180.

FIG. 17 is a diagram for explaining the sixth step of the manufacturingprocess of the display device 10. The sixth step is to form theinterlayer insulating film 190 on the sensor electrode 210. Theinterlayer insulating film 190 is formed of an inorganic insulating filmsuch as a silicon oxide film, a silicon nitride film, or a siliconoxynitride film. In the sixth step, for example, a sputtering method, aCVD method, or the like is used.

FIG. 18 is a diagram for explaining the seventh step of themanufacturing process of the display device 10. The seventh step is toform the lead wiring 216 and the bridge member 214A on the interlayerinsulating film 190. The lead wiring 216 is formed after the contacthole 192 is formed on the interlayer insulating film 190. The leadwiring 216 passes over the end of the oxide conductive layer 230provided with the sealing layer 180 to electrically connect the sensorelectrode 210 and the oxide conductive layer 230. The flexible printedboard 106 is then affixed to the peripheral region 104 of the substrate100 so as to be electrically connected to the terminal 109.

In the manufacturing process of the display device 10 described above,after the terminal wiring 220 is formed on the substrate 100, etching(e.g., dry etching) is performed a plurality of times. Even in thisinstance, since the oxide conductive layer 230 and 250 are provided onthe terminal wiring 220, the terminal wiring 220 is not etched whilebeing exposed. Therefore, the terminal wiring 220 is less likely to bedamaged due to over etching. The lead wiring 216 extends over thesealing layer 180 and over the oxide conductive layer 230. Therefore,the lead wiring 216 is difficult to break.

<6. Modifications>

The above-described embodiments can be applied by combining or replacingeach other. In the embodiment described above, it is also possible tocarry out the present invention by modifying it as described below.

(First Modification)

The first sensor electrode 210A and the second sensor electrode 210B maynot be transparent electrodes. FIG. 19 is a top view showing a part ofthe touch sensor 20 according to this modification. Specifically, thefirst sensor electrode 210A and the second sensor electrode 210B areformed using a non-translucent material. The non-translucent materialhere is a low resistance metal material. The first sensor electrode 210Ais metal film. The first sensor electrode 210A is formed in a mesh-likeshape. The metal material is, for example, aluminum (Al). The metalmaterial is not limited to aluminum (Al), and may be gold (Au), silver(Ag), copper (Cu), palladium (Pd), tungsten (W), or titanium (Ti).

The first sensor electrode 210A and the second sensor electrode 210Boverlap the region between the two adjacent pixels 130 when viewed fromthe top of the display device 10. In the case of FIG. 19 , the firstsensor electrode 210A and the second sensor electrode 2106 have anopening that overlaps the region between each and the two pixels 130 andoverlaps the two pixels 130. This makes it difficult for the firstsensor electrode 210A and the second sensor electrode 210B to preventthe light emitted from the pixel 130 from being transmitted to theoutside of the display device 10. The wiring line width of the firstsensor electrode 210A is, for example, several micrometers.

The two second sensor electrodes 210B adjacent to each other in the D1direction are electrically connected to each other via the bridge member214B. The bridge member 214B is formed of the same material as thesecond sensor electrode 210B. The second sensor electrode 210B and thebridge member 2146 may be formed physically integrally or separately. Inthe case of FIG. 19 , although, the bridge member 214B is composed ofthree wirings extending in the D1 direction, may be composed of two orless or four or more wirings.

(Second Modification)

Part of the configuration described in the above embodiment may beomitted or changed. For example, some layers may be excluded, or otherlayers may be provided from the cross-sectional structure of the displaydevice illustrated in the figures. Also, the flexible printed board fordriving the plurality of pixels 130 and the flexible printed board fordriving the touch sensor may be separately provided.

(Third Modification)

In the embodiment described above, the organic EL display device isexemplified as the disclosed example, but other application examplesinclude: a Liquid Crystal Display Device; other self-luminous displaydevice; an electronic paper type display device having electrophoreticdisplay element; and any flat-panel type display device.

Within the scope of the concept of the present invention, a personskilled in the art can conceive various changes and modifications, andit is understood that these changes and modifications also belong to thescope of the present invention. For example, with respect to each of theabove-described embodiments, those skilled in the art may appropriatelyadd, delete, or change the design of components, or may add, omit, orchange the conditions of processes, as long as it has the gist of thepresent invention, it is within the scope of the present invention.

What is claimed is:
 1. A display device comprising: a substrate; adisplay region arranged on the substrate and including a plurality ofpixels; a first wiring provided on the substrate; an oxide conductivelayer provided on the first wiring and electrically connected to thefirst wiring; a sealing layer overlapping the display region and sealingthe plurality of pixels; a sensor electrode provided on the sealinglayer and overlapping the display region; and a second wiring passingover at least a portion of an end of the oxide conductive layer providedwith the sealing layer and electrically connecting the sensor electrodeand the oxide conductive layer, wherein the sealing layer overlaps atleast the portion of the end of the oxide conductive layer.
 2. Thedisplay device according to claim 1, wherein the sealing layer includesat least one inorganic film.
 3. The display device according to claim 1,wherein the sealing layer includes an opening above the oxide conductivelayer, the sealing layer is provided so as to surround all ends of theopening to expose a surface of the oxide conductive layer in a regionsurrounded by the ends.
 4. The display device according to claim 1,further comprising: an insulating layer provided immediately below thesecond wiring.
 5. The display device according to claim 4, wherein theinsulating layer includes a first opening exposing the oxide conductivelayer, and an end of the sealing layer is provided between an end of thefirst opening and the display region.
 6. The display device according toclaim 1, further comprising a third wiring provided between the oxideconductive layer and the second wiring.
 7. The display device accordingto claim 1, further comprising: a flexible printed circuit boardelectrically connected to the first wiring, wherein the flexible printedcircuit board drives the plurality of pixels and a touch sensorincluding the sensor electrode.
 8. The display device according to claim1, further comprising: a second oxide conductive layer provided on thefirst wiring and electrically connected to the first wiring; and aflexible printed circuit board driving a touch sensor including thesensor electrode, wherein the sealing layer is further provided on atleast an end of the second oxide conductive layer, the flexible printedcircuit board is provided on the end of the second oxide conductivelayer provided with the sealing layer, and is electrically connected tothe second oxide conductive layer.
 9. The display device according toclaim 1, wherein the sensor electrode includes a first sensor electrodeand a second sensor electrode, and the first sensor electrode and thesecond sensor electrode are insulated from each other and provided onthe same insulating surface.
 10. A display device comprising: asubstrate; a display region arranged on the substrate and including aplurality of pixels; a first wiring provided on the substrate; aninsulating layer overlapping a portion of the first wiring; an oxideconductive layer provided on the first wiring and electrically connectedto the first wiring; a sealing layer overlapping the display region; asensor electrode provided on the sealing layer and overlapping thedisplay region; and a second wiring passing over at least a portion ofan end of the oxide conductive layer provided with the sealing layer andelectrically connecting the sensor electrode and the oxide conductivelayer, wherein the sealing layer overlaps at least the portion of theend of the oxide conductive layer.
 11. The display device according toclaim 10, wherein the sealing layer includes at least one inorganicfilm.
 12. The display device according to claim 10, wherein the sealinglayer includes an opening above the oxide conductive layer, the sealinglayer is provided so as to surround all ends of the opening to expose asurface of the oxide conductive layer in a region surrounded by theends.
 13. The display device according to claim 10, further comprising:a second insulating layer provided immediately below the second wiring.14. The display device according to claim 13, wherein the secondinsulating layer includes a first opening exposing the oxide conductivelayer, and an end of the sealing layer is provided between an end of thefirst opening and the display region.
 15. The display device accordingto claim 10, further comprising a third wiring provided between theoxide conductive layer and the second wiring.
 16. The display deviceaccording to claim 10, further comprising: a flexible printed circuitboard electrically connected to the first wiring, wherein the flexibleprinted circuit board drives the plurality of pixels and a touch sensorincluding the sensor electrode.
 17. The display device according toclaim 10, further comprising: a second oxide conductive layer providedon the insulating layer and electrically connected to the first wiring;and a flexible printed circuit board driving a touch sensor includingthe sensor electrode, wherein the sealing layer is further provided onat least an end of the second oxide conductive layer, the flexibleprinted circuit board is provided on the end of the second oxideconductive layer provided with the sealing layer, and is electricallyconnected to the second oxide conductive layer.
 18. The display deviceaccording to claim 10, wherein the sensor electrode includes a firstsensor electrode and a second sensor electrode, and the first sensorelectrode and the second sensor electrode are insulated from each otherand provided on the same insulating surface.
 19. The display deviceaccording to claim 10, wherein the insulating layer is a layercontaining an organic material.
 20. A display device comprising: asubstrate; a display region arranged on the substrate and including aplurality of pixels; a first wiring provided on the substrate; an oxideconductive layer provided on the first wiring and electrically connectedto the first wiring; a sealing layer overlapping the display region; asensor electrode provided on the sealing layer and overlapping thedisplay region; and a second wiring passing over at least a portion ofan end of the oxide conductive layer provided with the sealing layer andelectrically connecting the sensor electrode and the oxide conductivelayer, wherein the sealing layer overlaps at least the portion of theend of the oxide conductive layer.